? semiconductor components industries, llc, 2011 april, 2011 ? rev. 7 1 publication order number: CM6300/d CM6300 emi filters with esd protection for sim card applications product description the CM6300 is a 3 x 3, 8 ? bump emi filter with esd protection device for sim card applications in 0.5 mm pitch csp form factor. it is fully compliant with iec 61000 ? 4 ? 2. the CM6300 is rohs ii compliant. table 1. pin descriptions 8 ? bump csp package pin description a2 channel 1 external a3 channel 1 internal b1 channel 2 external b2 gnd b3 channel 2 internal c1 channel 3 external c2 v external c3 channel 3 internal package / pinout diagrams bottom view (bumps up view) top view (bumps down view) 632 + orientation marking b1 a1 1 orientation marking b2 b3 c1 c2 c3 a2 a3 2 3 a b c 123 a b c electrical schematic v (c2) {external} internal o1 (a3) o2 (b3) o3 (c3) external i1 (a2) i2 (b1) i3 (c1) r1 r2 r3 gnd (b2) marking diagram device package shipping ? ordering information http://onsemi.com csp ? 8 (pb ? free) 5000/tape & reel CM6300 632 = CM6300 wwyy = date code wlcsp8 case 567cd ?for information on tape and reel specifications, including part orientation and tape sizes, please refer to our tape and reel packaging specification brochure, brd8011/d. 632 wwyy +
CM6300 http://onsemi.com 2 electrical specifications and conditions table 2. parameters and operating conditions parameter rating units storage temperature range ?55 to +150 c operating temperature range ?40 to +85 c table 3. electrical operating characteristics (note 1) symbol parameter conditions min typ max units r 1 resistance 80 100 120 r 2 resistance 37.6 47 56.4 r 3 resistance 80 100 120 c capacitance on filter channels 1, 2 and 3 at 1 mhz, v in = 0 v 13.4 16.7 20 pf capacitance on clamp channel (pin c2) at 1 mhz, v in = 0 v 8.2 10.3 12.4 pf v b breakdown voltage (positive) i f = 8 ma 6 6.8 20 v v esd esd protection peak discharge voltage at a2, b1 and c1 pins a) contact discharge per iec 61000 ? 4 ? 2 standard b) air discharge per iec 61000 ? 4 ? 2 standard (note 2) 15 15 kv esd protection peak discharge voltage at c2 pin a) contact discharge per iec 61000 ? 4 ? 2 standard b) air discharge per iec 61000 ? 4 ? 2 standard (note 2) 15 15 kv esd protection peak discharge voltage at a3, b3 and c3 pins a) contact discharge per iec 61000 ? 4 ? 2 standard b) air discharge per iec 61000 ? 4 ? 2 standard (note 2) 4 4 kv 1. all parameters specified at t a = 25 c unless otherwise noted. 2. standard iec 61000 ? 4 ? 2 with c discharge = 150 pf, r discharge = 330 . mechanical specification table 4. vertical st ructure dimensions (nominal) ref. parameter material dimension a die thickness silicon 396 m h repassivation polyimide 10 m d ubm ? (ti/cu) plated cu 5.0 m sputtered cu 0.4 m sputtered ti 0.1 m e ubm wetting area diameter 280 m b bump standoff 240 m f solder bump diameter after bump reflow 320 m c metal pad height alsicu 1.5 m g metal pad diameter 60 m d1 finished thickness 0.650 mm d2 0.406 mm vertical structure specification* figure 1. sectional view * daisy chain cm6020
CM6300 http://onsemi.com 3 rf characteristics figure 2. insertion loss, filter 1 (pins a2, a3) and filter 3 (pins c1, c3) (bias = 0 v, t a = 25 c) figure 3. insertion loss, filter 2 (pins b1, b3) (bias = 0 v, t a = 25 c)
CM6300 http://onsemi.com 4 package dimensions wlcsp8, 1.6x1.6 case 567cd ? 01 issue o seating plane 0.05 c notes: 1. dimensioning and tolerancing per asme y14.5m, 1994. 2. controlling dimension: millimeters. 3. coplanarity applies to spherical crowns of solder balls. 2x dim a min max 0.61 millimeters a1 d 1.60 bsc e b 0.29 0.34 e 0.50 bsc 0.69 d e a b pin a1 reference a 0.05 b c 0.03 c 0.05 c 8x b 123 c b a 0.05 c a a1 a2 c 0.21 0.27 1.60 bsc 0.50 0.25 8x dimensions: millimeters *for additional information on our pb ? free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. soldering footprint* 0.05 c 2x top view side view bottom view note 3 e a2 0.41 ref recommended a1 package outline e pitch 0.50 pitch on semiconductor and are registered trademarks of semiconductor components industries, llc (scillc). scillc reserves the right to mak e changes without further notice to any products herein. scillc makes no warranty, representation or guarantee regarding the suitability of its products for an y particular purpose, nor does scillc assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including wi thout limitation special, consequential or incidental damages. ?typical? parameters which may be provided in scillc data sheets and/or specifications can and do vary in different application s and actual performance may vary over time. all operating parameters, including ?typicals? must be validated for each customer application by customer?s technical experts. scillc does not convey any license under its patent rights nor the rights of others. scillc products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the scillc product could create a sit uation where personal injury or death may occur. should buyer purchase or use scillc products for any such unintended or unauthorized application, buyer shall indemnify and hold scillc and its of ficers, employees, subsidiaries, af filiates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, direct ly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that scillc was negligent regarding the design or manufacture of the part. scillc is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyright laws and is not for resale in any manner. publication ordering information n. american technical support : 800 ? 282 ? 9855 toll free usa/canada europe, middle east and africa technical support: phone: 421 33 790 2910 japan customer focus center phone: 81 ? 3 ? 5773 ? 3850 CM6300/d literature fulfillment : literature distribution center for on semiconductor p.o. box 5163, denver, colorado 80217 usa phone : 303 ? 675 ? 2175 or 800 ? 344 ? 3860 toll free usa/canada fax : 303 ? 675 ? 2176 or 800 ? 344 ? 3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : www.onsemi.com order literature : http://www.onsemi.com/orderlit for additional information, please contact your local sales representative
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